Advanced Process Optimization For BGA & Flex Connector Manufacturing

Many SMT production lines lose yield due to gaps between processes—disconnects in the interactions of materials, printing, placement, reflow, inspection, and cleaning. This engineering programme addresses those gaps by providing engineers a standardized best-practice methodology to optimize Plastic BGA and Flex Connector manufacturing lines, reducing flaws at every hand-off point.

Rather than covering basic SMT operations, the programme is designed for engineering optimization—integrating materials science, statistical process control (SPC), Design of Experiments (DOE), advanced reflow technology, X-ray inspection, and failure analysis into one connected framework.

Content is based on real manufacturing processes using direct ball placement systems, solder paste printing, and flux pin transfer technologies, enabling participants to map training directly to their production line and apply it immediately to reduce process variation and enhance yield.

Upon completion, participants will be able to:

• Understand how material properties influence process capability and product reliability

• Develop robust incoming quality controls for connectors, plating, solder balls, solder paste and flux

• Optimize solder paste printing and flux pin transfer processes

• Apply DOE techniques to optimize fluxing, printing, reflow and cleaning

• Develop robust reflow profiles for different connector products

• Compare convection, IR, nitrogen and vacuum reflow technologies

• Interpret 3D SPI, AOI, 2D X-ray and 3D CT inspection results

• Optimize spray jet cleaning processes

• Apply SPC, 5 Whys and Fishbone diagram methodology for root cause analysis to improve manufacturing yield

• Correlate inspection and reliability data to drive continuous process improvement

• Identify and close process-interaction gaps across the line using a Process Interaction Matrix (PIM) to stop defects propagating between stations

Duration

2 days | 64 hours (including 1-hour lunch)

Methodology

Instructor-led lectures paired with hands-on practical exercises.

Target Audience

Process, manufacturing, quality and equipment engineers, technicians and managers responsible for yield improvement, defect reduction and process capability in plastic BGA and flex connector manufacturing.

Course Level

Advanced — an engineering-level process optimization course, not an introduction to basic SMT operations. Best suited for participants who already have hands-on exposure to SMT or production processes.

Pre-requisites

Certificate, Diploma or Degree in Engineering or Sciences; working familiarity with SMT/manufacturing process flow is recommended.